Semiconductor lithography equipment, which prints minute circuits on semiconductor wafers—the key devices supporting today’s advanced information society—and FPD lithography equipment, which prints circuits on flat panel displays (FPDs) used in smartphones, PCs, televisions and more, are becoming increasingly important with the advancement of AI and the highly information-oriented society.
In particular, semiconductor lithography equipment has evolved from exposure using g-line, i-line, and excimer laser (KrF/ArF) light sources to the introduction of EUVL (Extreme Ultra Violet Lithography), an ultra-fine lithography technology, now implemented in mass production lines for semiconductor manufacturing.

In FPD lithography equipment, substrate sizes have expanded to the 10.5th generation (2,940 mm × 3,370 mm). Lithography systems are being developed to meet the demands of next-generation FPD technologies such as OLED and Mini LED, which require higher definition.
Based on our long-standing expertise in high precision surface and curved surface processing, combined with advanced multi-layer thin film coating technology, NITTO OPTICAL manufactures a wide range of optical components (high precision prisms, large bar mirrors, corner cube prisms, etc.) for use in semiconductor and FPD manufacturing equipment, including illumination, light source and stage mechanisms, SEM (Scanning Electron Microscope) systems for analyzing semiconductor defects, and EB (electron beam) lithography systems for mask production.

In particular, for FPD manufacturing equipment, we produce ultra-long bar mirrors exceeding 3,000 mm to support large-size substrates of the 10.5th generation. Furthermore, bar mirrors can be manufactured from various optical materials such as quartz, ceramics, and low-expansion materials, tailored to meet the requirements of the latest lithography equipment.